Refroid Technologies and Technavious Partner to Deliver Sovereign Liquid Cooling for India’s AI Data Centres

Refroid Technologies, India’s pioneer in indigenous high-density liquid cooling, partners with Technavious Solutions, a global data centre engineering and TIA-942 certification specialist, to create end-to-end “brick-to-chip” infrastructure frameworks optimised for AI workloads exceeding 500W TDP per processor. The alliance bridges critical gaps between advanced cooling hardware and MEP commissioning, enabling hyperscalers and enterprises to deploy liquid-cooled facilities without imported dependencies.
Strategic tracks include hyperscale Direct Liquid Cooling (DLC) integration via Refroid’s Sentraflo CDUs engineered by Technavious for optimal secondary loop stability, redundancy, and thermal efficiency supporting massive GPU clusters. For edge/enterprise deployments, self-contained Liquid Immersion Cooling Pods enable high-density AI compute within existing facilities, eliminating costly retrofits.
A breakthrough feature integrates Refroid’s Hybrid Load Banks (Thermion) into Technavious’s Level 1-7 commissioning process, enabling true Level 5 Integrated Systems Testing (IST) that simulates air+liquid thermal loads before expensive IT hardware arrives. This validates CDU logic, pump curves, heat rejection, and failure scenarios, critical for AI reliability.
Technavious CEO Senthil Kumar R emphasised sovereign “Make in India” pathways, achieving ultra-low PUE in India’s ambient conditions. Refroid CEO Satya Bhavaraju highlighted accelerated sovereign AI infrastructure amid India’s 10GW data centre pipeline targeting 2028.
The partnership supports IndiaAI Mission’s sovereign compute goals, reducing capex variability and enhancing ESG compliance through 40%+ energy savings versus air cooling.